• IEEE WIE DAY 2026 @ IEEE TENSYMP 2026

    Pulau Pinang Pulau Pinang, Pulau Pinang, Malaysia
    Seminar

    💜 IEEE WIE DAY 2026 @ IEEE TENSYMP 2026 💜 🚀 Technology with Purpose Women Driving Future Technologies for Humanity 📅 29 June 2026 (Monday) 🕟 4:30 PM – 6:30 PM (MYT) 📍 Room 2203, PSDC Penang & Online Session 🌐 Hybrid Event 🎤 Leadership Dialogue (Hybrid) Hear inspiring insights from representatives of: • IEEE WIE Region 10 • IEEE WIE Malaysia • Industry Leaders Whether you are a student, young professional, researcher, or industry practitioner, join us to learn, connect, and be inspired. 💻 Can't attend physically? You are welcome to join online from anywhere in the world. Please register so that we can share the meeting link and event updates. 🤝 Interactive & Networking Session ✨ WIE Day 2026 Celebration ✨ IEEE Region 10 Student Activities Sharing ✨ Networking & Coffee Session ✨ Cake Cutting Ceremony ✨ Doorgifts & Lucky Draw 🎁 FREE for non-registered TENSYMP participants 🔗 Register now: https://bit.ly/WIE_Tensymp26 💜 Wear Purple to Celebrate and Support WIE Day 2026!

  • EEE Senior Member Elevation Workshop (Online): Hands-on Application Preparation and Submission Guidance

    Online

    We are pleased to invite eligible IEEE members to participate in the following workshop: IEEE Senior Member Elevation Workshop (Online): Hands-on Application Preparation and Submission Guidance This online workshop is specially organized to assist and guide eligible IEEE members in preparing the required documents and completing the IEEE Senior Member application process. Participants will receive practical guidance on application preparation, supporting documentation, and submission procedures. The session will be delivered by: Prof. Ir. Dr. Zuhaina Zakaria Past Chair, IEEE Admission and Advancement Committee Workshop Details Date: Friday, 17 July 2026 Time: 9:00 AM – 12:00 PM Mode: Online The online meeting link will be emailed to all registered participants prior to the workshop. Eligible members are highly encouraged to participate in this workshop and take advantage of this opportunity to advance their professional recognition within IEEE. Check your eligibility here: Please register through the following link: Should you require further information, please feel free to contact us. We look forward to your participation. Thank you. Best regards, IEEE Malaysia Section Education Society (EdSoc) Chapter IEEE Malaysia Section Electron Devices Society (EDS) Chapter

  • IEEE Senior Member Elevation Workshop (Online): Hands-on Application Preparation and Submission Guidance

    Online

    Greetings from the IEEE Malaysia Section Education Society (EdSoc) Chapter and the IEEE Malaysia Section Electron Devices Society (EDS) Chapter. We are pleased to invite eligible IEEE members to participate in the following workshop: IEEE Senior Member Elevation Workshop (Online): Hands-on Application Preparation and Submission Guidance This online workshop is specially organized to assist and guide eligible IEEE members in preparing the required documents and completing the IEEE Senior Member application process. Participants will receive practical guidance on application preparation, supporting documentation, and submission procedures. The session will be delivered by: Prof. Ir. Dr. Zuhaina Zakaria Past Chair, IEEE Admission and Advancement Committee Workshop Details: Date: Friday, 17 July 2026 Time: 9:00 AM - 12:00 PM (GMT+8) Mode: Online The online meeting link will be emailed to all registered participants prior to the workshop. Eligible members are highly encouraged to participate in this workshop and take advantage of this opportunity to advance their professional recognition within IEEE. Check your eligibility here: https://www.ieee.org/membership/senior-member.html Please register through the following link: Should you require further information, please feel free to contact us. We look forward to your participation. Thank you. Best regards, IEEE Malaysia Section Education Society (EdSoc) Chapter IEEE Malaysia Section Electron Devices Society (EDS) Chapter

  • 2026 IEEE International Conference on Innovation, Ethics & Emerging Tech in Engineering and Computing Education, IE2C 2026

    Kuala Lumpur Kuala Lumpur, Kuala Lumpur, Malaysia
    Conference

    With great pleasure, we announce the 2026 IEEE International Conference on Innovation, Ethics, and Emerging Technology in Engineering and Computing Education (IE2C 2026), which will be held on July 25, 2026, in Kuala Lumpur, Malaysia. IE2C 2026 will be organised by the IEEE Education Society Malaysia Chapter. Authors are invited to submit full papers describing original research. Areas of interest include, but are not limited to, the following tracks: Area of Interest Smart & Intelligent Electronics for Next-Generation Education – Transforming E&E education through intelligent, AI-driven learning systems. Semiconductor, Microelectronics & Nanoelectronics Education – Advancing chip design and nano-education for future semiconductor talent Sustainable Power, Energy & Green Electronics – Promoting clean energy and eco-friendly design in electronics education Immersive & Simulation-Based Learning in Engineering – Enhancing learning via AR/VR labs, gamification, digital twins, and other emerging technologies. Embedded Systems, IoT & Edge Intelligence in Education - Hands-on IoT and embedded learning for smart system prototyping. Human-Centered, Inclusive & Ethical Innovation in Engineering Education - Engineering ethical, inclusive technologies for societal impact and resilience Interdisciplinary & Creative Approaches in STEM & E&E - Blending engineering with arts, design, and cross-domain innovation. Future-Ready Skills & Global Engineering Education - Preparing engineers for Industry 4.0 and global collaboration. Pedagogical Innovations & Outcome-Based Excellence – Driving competency and outcome-based engineering education reform Leadership, Well-Being & Institutional Transformation – Shaping inclusive, resilient education through leadership and innovation. Publication Once they meet the requirements of an IEEE quality review, the proceedings of IE2C 2026 may be eligible for inclusion in the IEEE Xplore® Digital Library. Important Dates  Extended Submission Deadline (Full Paper): 15th June 2026 Notification of Acceptance: 30th June 2026 Camera-Ready Deadline: 15th July 2026 Conference Date: 25th July 2026 Submission To submit your manuscript, please go to this link: https://www.ihsanyassin.com/cms/authentication/login.php IE2C Website For more information, please visit the IE2C website: https://shorturl.at/6Ju1V LinkedIn Link https://my.linkedin.com/in/ie2c-conference-ieee Contact IE2C 2026 Secretariat Faculty of Electrical Engineering Universiti Teknologi MARA 40450 Shah Alam Malaysia email: ie2c.conference@gmail.com

  • 12th International Conference on Smart Instrumentation, Measurement & Applications (ICSIMA 2026)

    Kuching Kuching, Sarawak, Malaysia
    Conference

    Researchers, academicians, and industry practitioners are invited to submit original papers to ICSIMA 2026, organized by the IEEE Instrumentation & Measurement Society Malaysia Chapter. Theme: Advancing Smart Instrumentation and Measurement for Sustainable, Resilient and Intelligent Systems Conference Date: 29–30 July 2026 Venue: The Waterfront Hotel Kuching, Sarawak, Malaysia Topics Include: * Smart Sensors & Measurement Systems * AI & Data Analytics for Measurement * Industrial Process Instrumentation * Healthcare & Biomedical Instrumentation * Sustainable & Green Measurement Technologies Best Paper Awards: Gold Award Silver Award Bronze Award Publication: All accepted papers will be submitted for publication in IEEE Xplore and indexed in Scopus. Important Dates: Full Paper Submission: 31 May 2026  18 June 2026  EXTENDED! Notification of Acceptance: 25 June 2026 30 June 2026 Camera-ready Submission: 30 June 2026 3rd July 2026 Early Registration Deadline: 30 June 2026 3rd July 2026 Registration Deadline: 15 July 2026 Submission: Submit your paper: https://edas.info/N34870 Conference Website: https://icsima.ieeemy-ims.org/26/ Home - ICSIMA 2026 We look forward to welcoming you to ICSIMA 2026 in Kuching, Sarawak, Malaysia. Organizing Committee ICSIMA 2026

  • IEEE Symposium on Computers & Informatics (ISCI 2026)

    Kuala Lumpur Kuala Lumpur, Kuala Lumpur, Malaysia
    Conference

    EEE Symposium on Computers & Informatics (ISCI 2026) – Call for Papers & Reviewers! Concorde Hotel, Kuala Lumpur, Malaysia August 8-9, 2026   The IEEE Symposium on Computers & Informatics (ISCI 2026) invites researchers, academicians, scientists, engineers, and industry practitioners to submit original, unpublished research papers describing novel research results, practical experiences, and innovative applications in intelligent systems and computing technologies. ISCI 2026 will be held in Kuala Lumpur, Malaysia, in conjunction with Visit Malaysia Year 2026, offering participants an excellent opportunity to combine academic engagement with cultural and professional exploration in one of Southeast Asia’s most dynamic cities. Conference Topics Authors are invited to submit papers in areas including, but not limited to: Artificial Intelligence and Machine Learning Computer Applications, Engineering & Informatics Computer Networks and Communications Industrial Electronics & Applications Internet of Things (IoT) Paper Submission Submitted papers must be original and not under review elsewhere. All submissions will be evaluated through a rigorous double-blind peer-review process. Accepted papers must be presented at the conference by at least one registered author. Paper Submission Deadline: April 30, 2026 (extended) Notification of Acceptance: March 1, 2026, onwards Camera-Ready Submission: May 1, 2026, Author Registration Deadline: May 1, 2026   Submissions are welcome from both local and international participants; hence, please submit your papers via our submission system: https://tinyurl.com/ISCI-register Publication and Indexing All accepted and presented papers will be submitted for possible inclusion in the official conference proceedings and are intended for publication in: IEEE Xplore Digital Library Abstracting & Indexing (A&I) databases Note: Final inclusion in indexing databases is subject to meeting quality standards and publisher requirements. Why Attend ISCI 2026 Present your work at a recognized international IEEE-aligned symposium Engage with leading researchers, academics, and industry professionals Build international collaborations and research networks Increase research visibility through reputable publication and indexing channels Visit Malaysia Year 2026 ISCI 2026 coincides with Visit Malaysia Year 2026, a national initiative promoting Malaysia as a global tourism and business destination. Conference participants are encouraged to: Experience Malaysia’s cultural diversity, modern infrastructure, and renowned hospitality Explore Kuala Lumpur, a regional hub for technology, innovation, and research Combine scholarly participation with meaningful travel and cultural experiences Call for Reviewers Qualified researchers and professionals are invited to serve as reviewers for ISCI 2026. Reviewer benefits include: Contribution to maintaining high academic standards Early exposure to emerging research An official letter of appreciation for each completed review Please register at https://www.tinyurl.com/ISCI2026. Conference Information Website: https://www.tinyurl.com/ISCI2026 Facebook: https://www.facebook.com/ieee.isci/ LinkedIn: https://www.linkedin.com/company/ieee-isci/ YouTube: https://www.youtube.com/@ISCI_IEIA We look forward to welcoming you to ISCI 2026 in Kuala Lumpur, Malaysia, and to your valuable contributions toward advancing intelligent systems and computing innovations.

  • 2026 IEEE International Conference on Advanced Power Engineering and Energy (APEE)

    Johor Bahru Johor Bahru, Johor, Malaysia
    Conference

    2026 IEEE International Conference on Advanced Power Engineering and Energy (APEE) 2-3 September 2026 Assalamualaikum wbt / Salam Sejahtera, On behalf of the organizing committee, we are pleased to extend an invitation for you to submit a full paper to the 2026 IEEE International Conference on Advanced Power Engineering and Energy (APEE) conference. The APEE 2026 is the 2nd meeting of this conference series. The conference is organized by the Department of Electrical Power Engineering, Faculty of Electrical Engineering, Universiti Teknologi Malaysia, and co-sponsored by the IEEE Power Electronics Society (PELS) Malaysia Chapter. Conference Details: - Conference Name: IEEE APEE 2026 - Date: 2-3 September 2026 - Location: Johor Bahru, Malaysia Key Submission Deadlines: - Full Paper Submission Deadline: 30 April 2026 - Notification of Acceptance: 30 June 2026 The conference program features a technical paper presentation and a specialized exhibition. The proceedings of APEE 2026 may be eligible for inclusion in the IEEE Xplore® Digital Library once they meet the requirements of IEEE quality review. IEEE reserves the right not to publish any proceedings not meeting the standards. We believe that your expertise would make a valuable contribution to the conference, and we encourage you to share your latest research and insights with fellow professionals and researchers in the field. For detailed submission instructions and to access the submission system, please visit the conference website: https://attend.ieee.org/apee-2026/ Paper submissions are through the following link: https://attend.ieee.org/apee-2026/submission/ Authors are invited to submit full papers describing original research. Areas of interest include, but are not limited to, the following conference tracks: - Electrical Energy - High Voltage - Power Electronics - Power Systems Review Process: All submitted papers will undergo a rigorous peer-review process, and authors will be notified of acceptance/rejection by 30 June 2026. We look forward to your active participation in APEE 2026 and anticipate a fruitful exchange of ideas and collaboration. Should you have any questions or require further information, please do not hesitate to contact the organizing committee at apee@utm.my. Thank you for considering our invitation, and we look forward to receiving your submission.   Best regards, Mohd Junaidi Abdul Aziz Conference Chair IEEE APEE 2026

  • 7th IEEE Industrial Electronics and Applications Conference (IEACon 2026)

    Kuala Lumpur Kuala Lumpur, Kuala Lumpur, Malaysia
    Conference

    Dear Esteemed IEEE Members, On behalf of the Organizing Committee, it is my great pleasure to invite you to participate in the 7th IEEE Industrial Electronics and Applications Conference (IEACon 2026), which will take place 7–8 September 2026 at JW Marriott Hotel, Kuala Lumpur, Malaysia. As a premier IEEE flagship conference, IEACon 2026 continues its tradition of providing a prestigious international platform for high-quality research, innovation, and collaboration in the fields of industrial electronics, power systems, renewable energy, control, and emerging applications. All accepted and presented papers, upon approval by the IEEE Conference Committee, will be published in IEEE Xplore® and indexed in EI Compendex, ensuring high international visibility and wide dissemination to the global research community. Selected outstanding papers (approximately 20%) will also be invited for extended publication in IEEE Transactions on Industry Applications (Q1 Journal) and IEEE IAS Magazine. Conference Highlights: Keynote Address by Dr. Sivaneasan Bala Krishnan, Singapore Institute of Technology, on “Electric Vehicles as Energy Storage in Smart Grids”. Technical Paper Presentations covering cutting-edge topics across industrial electronics and applications. Industry Exhibitions showcasing the latest innovations in power electronics, automation, renewable energy, and smart technologies. A prestigious venue at JW Marriott Hotel Kuala Lumpur, offering world-class facilities at the heart of Malaysia’s capital city. Why Join Us in 2026? Visit Malaysia Year 2026: Experience the vibrant culture, cuisine, and hospitality of Malaysia during this special year, with Kuala Lumpur as your gateway to world-renowned attractions. Perfect Venue: JW Marriott Hotel Kuala Lumpur combines comfort, luxury, and accessibility, located in the iconic Bukit Bintang district. Networking Opportunities: Engage with distinguished researchers, engineers, and industry leaders from across the globe.  Important Dates Submission of Full Paper Deadline: 1 April 2026 Notification of Paper Acceptance: 6 June 2026 Registration Deadline: 1 August 2026 Final Camera-Ready Deadline: 1 August 2026 Conference Dates: 7–8 September 2026  Conference Tracks Cloud Computing, Big Data & Software Engineering Control Systems, Robotics & Mechatronics Electrical Machines & Drives Electronic Systems on Chip & Embedded Control Industrial Automation, Communication & Networking Industrial Electronics & Applications Power Electronics Power Systems & Smart Grids Renewable Energy Sensors, Actuators & Micro-Nanotechnology Signal & Image Processing, Computational Intelligence  Registration Fees (Include all sessions, meals, and gala dinner – except student registration) IEEE Member: USD 440 | RM 1650 Non-IEEE Member: USD 550 | RM 2050 Student (IEEE Member): USD 390 | RM 1450 Non-Author Participation: USD 410 | RM 1550  Be Part of IEACon 2026 Elevate your research, engage with industry experts, and make an impact! Don’t miss this opportunity to share your work at the 7th edition of IEACon, connect with global leaders, and enjoy the unique experience of Visit Malaysia Year 2026.  Submit your full paper via EDAS: https://edas.info/N34332 Conference Website: https://ieeeieacon.org Contact Us: admin@ieeeieacon.org We sincerely look forward to welcoming you to Kuala Lumpur, Malaysia, for an inspiring and memorable IEEE IEACon 2026! Warm regards, Organising Committee IEEE Industrial Electronics and Applications Conference (IEACon 2026)

  • 2026 IEEE 9th International Conference on Signal and Image Processing Applications (ICSIPA)

    Melaka Melaka, Melaka, Malaysia
    Conference

    The 2026 IEEE 9th International Conference on Signal and Image Processing Applications (ICSIPA) invites original research paper submissions in signal, image, and video processing.  Venue: Holiday Inn Melaka, Malaysia Dates: 8–10 September 2026 Website: https://sps.ieeemy.org/icsipa2026/   Topics include (but are not limited to): Acquisition, Storage, Retrieval and Display Computer Vision Processing and Analysis Information Forensics and Security Biomedical Imaging and Signal Processing Applied Signal, Audio, Speech, Acoustic and Language Processing Trending Technologies in Signal and Image Processing Machine Learning for Signal and Image Processing  Submission: Full papers (max. 6 pages, IEEE format) Submit via EDAS: https://edas.info/N34780  Important Dates: Paper submission: 30 April 2026 Acceptance notification: 30 May 2026 Camera-ready & registration: 7 August 2026  Highlights: Professional registration allows one presenter to present up to two accepted papers Online presentation available for presenters with affiliations outside Malaysia All accepted and presented papers will be submitted for inclusion in IEEE Xplore and indexed in Scopus & Web of Science. We look forward to your submissions!   Syed Mohd Zahid Syed Zainal Ariffin General Chair, IEEE ICSIPA 2026

  • 8th IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET 2026)

    Kota Kinabalu Kota Kinabalu, Sabah, Malaysia
    Conference

    The IEEE Sabah Subsection and Universiti Malaysia Sabah (UMS) are organizing the 8th IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET 2026), which will be held at Sabah International Convention Centre (SICC), Kota Kinabalu, Malaysia, from 9 to 11 September 2026. The conference will provide an excellent platform for knowledge exchange between researchers working in the areas of Artificial Intelligence. Prospective authors are invited to submit a full paper (4-6 pages) describing original work on all aspects of artificial intelligence. Call for Papers Authors are invited to submit original, unpublished papers on all aspects of artificial intelligence. Topics include but not limited to: Biomedical, Health, and On-Device Applications Computational Intelligence, Modeling, and Optimization Computer Vision, Imaging and Perception Systems Data Intelligence, ICT, and Cybersecurity Energy, Environment, and Sustainability Systems Human-Centered and Interactive Expert System Intelligent Control, Simulation, and Robotics Sensing, Signals, and Communication Systems Paper Submission All accepted papers will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. Paper Submission Link: https://edas.info/N34899 Conference Website: https://sites.google.com/ums.edu.my/iicaiet-2026 Contact us at email: iicaiet2026@gmail.com Important Dates                                                                                Submission of full paper: 15 May 2026 31 May 2026 Notification of acceptance: 30 June 2026 onwards Submission of camera-ready paper: 31 July 2026 Payment Confirmation deadline: 31 July 2026 IEEE Xplore and Scopus Indexing IICAIET 2025 IICAIET 2024 IICAIET 2023 IICAIET 2022 IICAIET 2021 IICAIET 2020 IICAIET 2018 Call for Reviewers The committees of IICAIET2026 are calling for reviewers, if you are interested in reviewing papers, please take a few minutes to register via: https://forms.gle/mZPScFV86Bft5MQUA We look forward to receiving your submissions and seeing you at the conference. Thanks and Regards, Publicity Team IICAIET 2026

  • 6th International Conference on Smart Sensors and Applications (ICSSA 2026)

    Putrajaya Putrajaya, Putrajaya, Malaysia
    Conference

    The Faculty of Artificial Intelligence, Universiti Teknologi Malaysia (UTM), in collaboration with the IEEE Malaysia Section – Instrumentation and Measurement Society (IMS), proudly presents the 6th International Conference on Smart Sensors and Applications (ICSSA 2026). Conference details: 22–23 September 2026 Putrajaya, Malaysia Under the theme “Driving Innovation Beyond Boundaries for Tomorrow’s World”, the conference welcomes original research papers and practical innovations that address emerging challenges and opportunities in sensing technologies and smart systems. Conference Topics: * Sensor Technology * Smart Technology and Sustainable Systems * Medical, Healthcare and Bio-Inspired Applications * Next-Generation Communication Networks * Advanced Informatics in Computational Applications Important Dates: Extension of Paper Submission Deadline    : 10 June 2026 Notification of Acceptance                               : 26 June 2026 Early Bird Registration                                    : 20 July 2026 Normal Registration Deadline                          : 20 August 2026 Camera-Ready Submission                              : 20 August 2026 Publication: Accepted papers will be submitted for possible inclusion in IEEE Xplore, subject to meeting the scope and quality requirements of IEEE. Paper Submission: Submit your manuscript via EDAS https://edas.info/N34584 Website: fai.utm.my/icssa2026 Email: icssa.utm@gmail.com Fadhilah Abdul Razak, PhD Department of Smart Engineering and Advanced Technology (SEAT) Faculty of Artificial Intelligence (formerly known as Razak Faculty of Technology and Informatics) Universiti Teknologi Malaysia Jalan Sultan Yahya Petra, 54100 Kuala Lumpur, Malaysia  

  • ONLINE WORKSHOP: FROM DATA TO READY DATA

    Online

    Interested in learning how to prepare and preprocess data for deep learning applications? Join our online workshop: ✨ From Data to Ready Data: Fundamentals of Data Preprocessing for Deep Learning Applications 📅 22–23 September 2026 ⏰ 10:00 AM – 12:00 PM 💻 Google Meet 🐍 Hands-on with Python 💰 Registration Fees UiTM / IEEE YP Member 🎓 UiTM Student / IEEE Student: RM30 👨‍💼 UiTM Staff / IEEE Member: RM60 Others 🎓 Student: RM40 👨‍💼 Professional: RM70 🔗 Register now!: https://forms.gle/86vyUtwsCLCeEj4C6 Whether you are a student, academician, researcher, or professional, this workshop is a great opportunity to strengthen your understanding of data preprocessing and its role in Deep Learning. 📲 Feel free to share this invitation with your friends, students, colleagues, and professional networks