Call for Papers and Reviewers: 2026 16th IEEE Symposium on Computer Applications & Industrial Electronics (ISCAIE 2026) 25 – 26 April 2026,  Penang Island, Malaysia Website: https://tinyurl.com/u9sdftat Facebook: IEEE Symposium on Computer Applications & Industrial Electronics - Iscaie Linkedin: Linkedin - ISCAIE The IEEE Malaysia Industrial Electronics & Industrial Applications Joint Chapter is proud to announce the 2026 16th IEEE Symposium on Computer Applications & Industrial Electronics (ISCAIE 2026).  The event will be held in Penang Island, Malaysia, from the 25th to the 26th of April 2026. The symposium will provide an excellent platform for knowledge exchange between researchers, scientists, academicians, and engineers working in the areas listed here: - Computer Applications - Industrial Electronics - Computational Intelligence - Information Engineering - Network & Communication Technologies - Signal & Image Processing - Trusted Computing & Secure Systems - Software Engineering - Internet of Things This event calls for local and international participation. Please submit your papers via our submission system at: https://tinyurl.com/4ca499hp Accepted papers will be submitted for possible inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements. Important dates are listed below: Submission of full papers deadline: 25 October 2025 Issuance of notification of acceptance: 25 November 2025 Registration & camera-ready submission deadline: 25 January 2026 -------------------------------------------------------------------------------------------------------------------------------- PAST ISCAIE CONFERENCE SERIES ARE INDEXED IN IEEE XPLORE, SCOPUS AND WOS -------------------------------------------------------------------------------------------------------------------------------- https://ieeexplore.ieee.org/xpl/conhome/1800315/all-proceedings   ----------------------------------- CALL FOR REVIEWERS ------------------------------------ We would also like to invite you as a reviewer to help uphold the quality of submissions. If you are interested in doing so, please register here: https://tinyurl.com/4ca499hp Thank you, ISCAIE 2026 Organizing Committee

With great pleasure, we announce the 2026 IEEE International Conference on Innovation, Ethics, and Emerging Technology in Engineering and Computing Education (IE2C 2026), which will be held on July 25, 2026, in Kuala Lumpur, Malaysia. IE2C 2026 will be organised by the IEEE Education Society Malaysia Chapter. Authors are invited to submit full papers describing original research. Areas of interest include, but are not limited to, the following tracks: Area of Interest Smart & Intelligent Electronics for Next-Generation Education – Transforming E&E education through intelligent, AI-driven learning systems. Semiconductor, Microelectronics & Nanoelectronics Education – Advancing chip design and nano-education for future semiconductor talent Sustainable Power, Energy & Green Electronics – Promoting clean energy and eco-friendly design in electronics education Immersive & Simulation-Based Learning in Engineering – Enhancing learning via AR/VR labs, gamification, digital twins, and other emerging technologies. Embedded Systems, IoT & Edge Intelligence in Education - Hands-on IoT and embedded learning for smart system prototyping. Human-Centered, Inclusive & Ethical Innovation in Engineering Education - Engineering ethical, inclusive technologies for societal impact and resilience Interdisciplinary & Creative Approaches in STEM & E&E - Blending engineering with arts, design, and cross-domain innovation. Future-Ready Skills & Global Engineering Education - Preparing engineers for Industry 4.0 and global collaboration. Pedagogical Innovations & Outcome-Based Excellence – Driving competency and outcome-based engineering education reform Leadership, Well-Being & Institutional Transformation – Shaping inclusive, resilient education through leadership and innovation. Publication Once they meet the requirements of an IEEE quality review, the proceedings of IE2C 2026 may be eligible for inclusion in the IEEE Xplore® Digital Library. Important Dates  Extended Submission Deadline (Full Paper): 15th June 2026 Notification of Acceptance: 30th June 2026 Camera-Ready Deadline: 15th July 2026 Conference Date: 25th July 2026 Submission To submit your manuscript, please go to this link: https://www.ihsanyassin.com/cms/authentication/login.php IE2C Website For more information, please visit the IE2C website: https://shorturl.at/6Ju1V LinkedIn Link https://my.linkedin.com/in/ie2c-conference-ieee Contact IE2C 2026 Secretariat Faculty of Electrical Engineering Universiti Teknologi MARA 40450 Shah Alam Malaysia email: ie2c.conference@gmail.com

EEE Symposium on Computers & Informatics (ISCI 2026) – Call for Papers & Reviewers! Concorde Hotel, Kuala Lumpur, Malaysia August 8-9, 2026   The IEEE Symposium on Computers & Informatics (ISCI 2026) invites researchers, academicians, scientists, engineers, and industry practitioners to submit original, unpublished research papers describing novel research results, practical experiences, and innovative applications in intelligent systems and computing technologies. ISCI 2026 will be held in Kuala Lumpur, Malaysia, in conjunction with Visit Malaysia Year 2026, offering participants an excellent opportunity to combine academic engagement with cultural and professional exploration in one of Southeast Asia’s most dynamic cities. Conference Topics Authors are invited to submit papers in areas including, but not limited to: Artificial Intelligence and Machine Learning Computer Applications, Engineering & Informatics Computer Networks and Communications Industrial Electronics & Applications Internet of Things (IoT) Paper Submission Submitted papers must be original and not under review elsewhere. All submissions will be evaluated through a rigorous double-blind peer-review process. Accepted papers must be presented at the conference by at least one registered author. Paper Submission Deadline: April 30, 2026 (extended) Notification of Acceptance: March 1, 2026, onwards Camera-Ready Submission: May 1, 2026, Author Registration Deadline: May 1, 2026   Submissions are welcome from both local and international participants; hence, please submit your papers via our submission system: https://tinyurl.com/ISCI-register Publication and Indexing All accepted and presented papers will be submitted for possible inclusion in the official conference proceedings and are intended for publication in: IEEE Xplore Digital Library Abstracting & Indexing (A&I) databases Note: Final inclusion in indexing databases is subject to meeting quality standards and publisher requirements. Why Attend ISCI 2026 Present your work at a recognized international IEEE-aligned symposium Engage with leading researchers, academics, and industry professionals Build international collaborations and research networks Increase research visibility through reputable publication and indexing channels Visit Malaysia Year 2026 ISCI 2026 coincides with Visit Malaysia Year 2026, a national initiative promoting Malaysia as a global tourism and business destination. Conference participants are encouraged to: Experience Malaysia’s cultural diversity, modern infrastructure, and renowned hospitality Explore Kuala Lumpur, a regional hub for technology, innovation, and research Combine scholarly participation with meaningful travel and cultural experiences Call for Reviewers Qualified researchers and professionals are invited to serve as reviewers for ISCI 2026. Reviewer benefits include: Contribution to maintaining high academic standards Early exposure to emerging research An official letter of appreciation for each completed review Please register at https://www.tinyurl.com/ISCI2026. Conference Information Website: https://www.tinyurl.com/ISCI2026 Facebook: https://www.facebook.com/ieee.isci/ LinkedIn: https://www.linkedin.com/company/ieee-isci/ YouTube: https://www.youtube.com/@ISCI_IEIA We look forward to welcoming you to ISCI 2026 in Kuala Lumpur, Malaysia, and to your valuable contributions toward advancing intelligent systems and computing innovations.