IEEE Malaysia Students



  • Your Representatives:

    Dr. Alpha Agape Gopalai

  • Student Rep (Undergraduate)

    Mohammed Hussein Saleh Mohammed Haram

  • Section Activities Committee SAC

    Cindy Lai Poh Yuan (Curtin)
    Fakhriah Razali (UTHM)
    D. Sreenivasan (UniMAP)
    Chuang Jin Yee (Nottingham)
    Soh Shi Hui (UTAR)

2018 IEEE Malaysia Section FYP Competition


IEEE Malaysia Section invites Electrical/Electronic/Computer Engineering Students to participate in 2018 IEEE Malaysia Final Year Project (FYP) Competition. It is dedicated to ALL (member and non-member)  Undergraduate students who just recently completed or are currently undertaking their Final Year Project in Malaysian Universities/Institutions.

Submission Deadline is on 15th August 2018. 

For students who are interested, you need to only submit TWO items:

  1. POSTER summarising your Final Year Project (Softcopy Only) AND
  2. one page ABSTRACT explaining your Final Year Project (Softcopy Only)

Use the following templates:

[Poster] – Click here

[Abstract] – Click here

Prizes (for each track/subject area)

  • 1st Prize: RM300, a plaque and certificate from IEEE Malaysia
  • 2nd Prize: RM200, a plaque and certificate from IEEE Malaysia
  • 3rd Prize: RM100, a plaque and certificate from IEEE Malaysia

Certificate from IEEE Malaysia will be given to all participants

Tracks for submission

Students can submit their Final Year Project in one of the following tracks (only ONE track per submission).

Track 1: Telecommunication
Sponsor: IEEE Communications / Vehicular Technology (COMSOC/VT)

Track 2: Computational Intelligence
Sponsor: IEEE Computational Intelligence (CIS)

Track 3: Computer
Sponsor: IEEE Computer Society (CS)

Track 4: Dielectrics and Electrical Insulation
Sponsor: IEEE Dielectric and Electrical Insulation (DEIS)

Track 5: Electron Devices/Microwave Theory & Technique/Solid-State Circuits
Sponsor: IEEE Electron Device / Microwave Theory and Techniques / Solid-State Circuit (EDS/MTT/SSCS) Penang

Track 6: Electronics Packaging
Sponsor: IEEE Electronics Packaging Society (EPS)

Track 7: Biomedical & Rehabilitation Engineering
Sponsor: IEEE Engineering in Medicine & Biology (EMBS)

Track 8: Geoscience and Remote Sensing
Sponsor: IEEE Geoscience and Remote Sensing (GRS)

Track 9: Underwater Robotics and Underwater Sensor & Instrumentation System
Sponsor: IEEE Oceanic Engineering (OES)

Track 10: Robotics and Automation
Sponsor: IEEE Robotics & Automation Society (RAS)

Track 11: Signal and Image Processing and Analysis
Sponsor: IEEE Signal Processing (SP)

Track 12: Technology and Engineering Management
Sponsor: Technology & Engineering Management (TEMS)

Track 13: Power & Energy
Sponsor: Power and Energy (PES)

Rules and Regulations

  • Open for all undergraduate students (IEEE Member and Non-Member) who has just completed or is currently doing their Final Year Project (FYP) in Year 2018.
  • Individual projects and group projects are accepted.
  • The submitted Final Year Project project must be the student’s own project work NOT the work of others.

Submission Deadline: 15th August 2018.

Enquiries? Drop us an email

Submissions can be made HERE!


IMPORTANT: IEEE Malaysia Section has the right to reject your submission if the rules are not followed