GRA Vacancy for “Plasma modification for Anti-Fouling Application ” project

University / Institute Universiti Kebangsaan Malaysia Research Center/Lab (optional) Lab on Chip Project Title Plasma modification for Anti-Fouling Application Start Date Mar 19, 2019 End Date Jan 01, 2021 Funding Agency Ministry of Higher Education (MOHE) Contact Person / Email(s) Kom Shyong Siow /

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Invitation to join IEEE Malaysia Section Blockchain Group

Blockchain technology has received increased interests in recent years, from both the scientific community and the industry. Due to tremendous potential, this technology is now actively being explored and implemented in almost all industry verticals. According to a survey by World Economic forum, blockchain is anticipated to account for 10% … Continue reading


Call for Papers – The 18th International Conference on Intelligent Software Methodologies, Tools, and Techniques (SOMET_19) will take place on September 23~25, 2019, in the city of Kuching, Sarawak, Malaysia.

This event is a continuation of an existing series of SOMET. This conference series highlights and reflects the … Continue reading

2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE)

The 2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE 2019) will be held in the historical city, Malacca, Malaysia from November 25 to November 27.

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Fully sponsored by the IEEE AP/MTT/EMC (Antennas and Propagation, Microwave Theory and Techniques and Electromagnetic Compatibility) Joint … Continue reading

Invitation to 2019 IEEE R10 EAC Challenge

The 2019 IEEE Region 10 Education Activities (R10 EA) Challenge has been approved in the recent R10 Meeting at Melbourne.


Members are invited to submit proposals to organise educational programs/activities in R10 to focus on:-


1) Pre-University Education and

2) University Education.


Winner(s) may receive support of … Continue reading