(Free) DLP : Reliability and Its Applications to Solid State Lighting

You are cordially invited to a talk sponsored by the IEEE Electron Devices Society Distinguished Lecturer Program, IEEE Sarawak Subsection and Faculty of Engineering, Computing and Science Swinburne Sarawak Campus. Kindly RVSP via email: blau@swinburne.edu.my

Date: 6 July 2018 (Friday), 2.30pm-4.30pm

Venue: Swinburne Sarawak Campus, Block G, Level 4, Room G407

Title: Reliability and Its Applications to Solid State Lighting

Abstract: Reliability is a term that can be new to many in Asia, but its history begins right after World War 1.  Over the several decades, reliability engineering has been developed to become a complex multi-discipline and going toward reliability science.  This talk describes briefly the concept of reliability and its importance.  An example of reliability is in the solid state lighting.  Solid state lighting is emerging to replace the current lighting devices due to its much lower energy consumption and long life as well as its robustness and without mercury.  Its applications have moved from indoor to outdoor such as street lamp, vehicles etc.  However, these outdoor applications have their environmental conditions very different from its indoor applications and its lifetime become exceptionally low.  This talk will highlight how we use reliability science to understand such situation to serve as an example of the necessity and usefulness of reliability.

Speaker: EDS Distinguished Lecturer Professor Tan Cher Ming

Dr. Tan received his PhD in Electrical Engineering from the University of Toronto in 1992. He has 10 years of working experiences in reliability in electronic industry (both Singapore and Taiwan) before joining Nanyang Technological University (NTU) as faculty member in 1996 till 2014. He joined Chang Gung University, Taiwan and set up a research Center on Reliability Sciences and Technologies in Taiwan and acts as Center Director. He is Professor in Electronic Department of Chang Gung University, Chair Professor in Ming Chi University of Technology, Taiwan. He has published more than 300 International Journal and Conference papers, and giving more than 40 invited talks in International Conferences and several tutorials in International Conferences. He holds 12 patents and 1 copyright on reliability software. He has written 4 books and 3 book chapters in the field of reliability. He is an Editor of Scientific Report, Nature Publishing Group, an Editor of IEEE TDMR and Series Editor of SpringerBrief in Reliability. He is a member of the advisory panel of Elsevier Publishing Group. He is also in the Technical committee of IEEE IRPS.

He is a past chair of IEEE Singapore Section, senior member of IEEE and ASQ, Distinguished Lecturer of IEEE Electronic Device Society on reliability, Founding Chair and current Chair of IEEE Nanotechnology Chapter – Singapore Section, Fellow of Institute of Engineers, Singapore, Fellow of SQI, Executive Council member of SQI, Director of SIMTech-NTU Reliability Lab, and Senior Scientist in SIMTech. He is the Founding Chair of IEEE International Conference on Nanoelectronics, General Chair of ANQ Congress 2014. He is also the recipient of IEEE Region 10 Outstanding Volunteer Award in 2011. He is Guest Editor of International J. of Nanotechnology, Nano-research letter and Microelectronic Reliability. He is in the reviewer board of several International Journals such as Thin Solid Film, Microelectronic Reliability, various IEEE Transactions, Reliability Engineering and System Safety etc for more than 5 years. He is the only individual recipient of Ishikawa-Kano Quality Award in Singapore since 2014. He is also current active in providing consultation to multi-national corporations on reliability.

His research interests include reliability and failure physics modeling of electronic components and systems, finite element modeling of materials degradation, statistical modeling of engineering systems, nano-materials and devices reliability, and prognosis & health management of engineering system.

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