IEEE International Conference on Semiconductor Electronics (IEEE ICSE2018) “At the Edge of Nanotechnology”
ICSE2018 Call for Papers
August 15-17, 2018 ─ Pullman Kuala Lumpur City Centre, Malaysia
On behalf of the Organizing Committees, it is our pleasure to invite you to participate in the IEEE International Conference on Semiconductor Electronics (IEEE ICSE2018) with the theme “At the Edge of Nanotechnology”.
The Conference will take place on August 15-17, 2018, in Kuala Lumpur, Malaysia. The details on the registration, important dates, submission procedures and keynote speakers are available on http://ieeemalaysia-eds.org/icse2018/.
This bi-annual technical conference since 1992 aims at bringing together researchers from industry and academia to gather and explore various issues and trends in the field of semiconductor electronics. This is the 13th ICSE organized by the Electron Devices Chapter of IEEE Malaysia Section and technically co-sponsored by the IEEE Electron Devices Society. Over the last eighteen years, ICSE conference series has become the prominent international forum on semiconductor electronics embracing all aspects of the semiconductor technology from circuit device, modeling and simulation, photonics and sensor technology, MEMS technology, process and fabrication, packaging technology and manufacturing, failure analysis and reliability, material and devices and nanoelectronics.
Accepted AND presented papers will be published in conference proceeding and presented papers will be submitted to the IEEE Explore for further indexing.Accepted papers will be presented in oral session. Authors are invited to submit original, unpublished FULL PAPERS in the following areas, but not limited to MEMS &Nanoelectronics (Cluster 1), Nanophotonics (Cluster 2), IC Design and Manufacturing (Cluster 3) and Material, Process & Product (Cluster 4). Submission of papers is via EDAS (http://edas.info/)
We sincerely hope that this conference will be used for efficient exchange of information, prolific discussion, and the very necessary process of networking and strengthening of our interconnections. We look forward to welcome you in Kuala Lumpur, Malaysia in August 2018.