DEIS Malaysia Chapter 2018 AGM

We are pleased to inform you that the 2018 AGM of IEEE Dielectrics and Electrical Insulation Society (DEIS) Malaysia Chapter will be held as follows:

Date: 08 February 2018 (Thursday)
Time: 3:45 pm – 4:45 pm
Venue: Seminar Hall, Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM Serdang, Selangor

 

Tentative Agenda: 

  1. Welcoming address by 2017 Chapter Chair
  2. To accept meeting minutes of 2017 AGM
  3. 2017 Chapter activities report by Chair
  4. 2017 Chapter account report by Treasurer
  5. Dissolution of 2017 Committee Members
  6. Election of 2018 Committee Members
  7. Address by the 2018 Chapter Chair
  8. Other matters

Gentle reminder: Please renew your 2018 IEEE DEIS membership prior to the AGM.

 

Please RSVP your attendance at goo.gl/LdTxfi

 

We look forward to your continuous support. Your attendance is highly appreciated.

Thank you.

Best regards,
Hazlee
—-
Associate Professor Ir. Dr. Hazlee Azil Illias
B.Eng (UM), PhD (UK)
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