CFP – 2014 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS 2014) | 1-4 Dec 2014

International Symposium on Intelligent Signal Processing and
Communication Systems (ISPACS 2014)

*** Submission website is now open ***
https://cmt.research.microsoft.com/ISPACS2014/

Date: December 1~4, 2014
Venue: Hilton Kuching Hotel, Sarawak, Malaysia
Official website: http://www.ispacs2014.org/
Submission website: https://cmt.research.microsoft.com/ISPACS2014/
Contact e-mail address: ispacs2014@gmail.com

Please accept our apologies for any multiple posting. Kindly help us
to broadcast this event and disseminate the information.

On behalf of the organizing committee, I am pleased to announce that
ISPACS 2014 (International Symposium on Intelligent Signal Processing
and Communication) will take place in Kuching, Sarawak, Malaysia on
December 1~4, 2014. The ISPACS 2014 will be the 22nd event in its
series.

The International Symposium on Intelligent Signal Processing and
Communication Systems (ISPACS) is the premier networking forum of
leading researchers especially from Asia-Pacific basin in the highly
active fields of theory, design and implementation of intelligent
signal processing and communication systems. The symposium presents
every possibility on new technologies based on signal processing and
communication.

The ISPACS 2014 will include regular sessions on the topics listed
below and some special sessions on emerging intelligent signal
processing and communication system topics, but not limited to:

1. Communication Systems
2. Multimedia and Systems
3. Signal Processing
4. VLSI
5. Circuits and Systems
6. Emerging Technologies in Signal Processing and Communications

** Important dates **
Deadline for submission of special session proposal: June 9, 2014
Deadline for submission of full paper: July 14, 2014
Notification of acceptance: Sept. 15, 2014
Deadline for submission of camera-ready paper: Oct.13, 2014

All accepted and presented papers will be included in the Conference
Proceedings and will be available on IEEE Xplore.

We look forward to your participation and see you in Kuching!

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