The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system, board, and device testing with design, manufacturing, and field consideration in mind.

Original papers on, but not limited to, the following areas are invited. 

  • Analog/Mixed-Signal Test
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Connectivity Testing
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DFT)
  • Diagnosis and Silicon Debug
  • Economic of Test
  • Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • Hardware-Oriented Security and trust
  • High-Speed I/O Test
  • Low-Power IC Test
  • Machine Learning in Test
  • Memory Test and Repair
  • Multi-/Many-core Processor Test
  • Online Test
  • Power/Thermal/Reliability Issues in Test
  • Reconfigurable System Test
  • RF Test
  • Self-Repair
  • SiP, Stacked, 3D IC Test
  • Standards in Test
  • Test Compression
  • Test for Biomedical Circuits and Systems
  • Test for MEMS and Microfluidic Systems
  • Test for Nanoscale Devices and Emerging Technologies
  • Test for Reversible and Quantum Circuits
  • Test for Sensors and IoT
  • Test Quality
  • Test Synthesis
  • Validation and Verification
  • Yield Analysis and Enhancement

Regular Sessions:

The ATS’20 Organizing Committee invites original, unpublished paper submissions on the above topics. Paper submission shall be complete manuscripts, not exceeding six pages in a standard IEEE two-column format. The submission will be considered evidence that upon acceptance the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium. Each accepted contribution must have at least one full paid registration by the time the camera ready paper is submitted for inclusion in the proceedings. ATS reserves the right to remove from IEEEXplore papers not presented at the symposium.

Paper Submission:

All submission should be made electronically in PDF format at ( A submission should contain a complete manuscript within a limit of 6 pages in 10-point single-spaced double-column format, and an abstract of 50-200 words. The paper must be submitted for blind review process. Once a submission is accepted, the author(s) must prepare the final camera-ready manuscript in time for inclusion in the proceedings, and present the paper at the symposium. In case of any difficulty in submission, authors may contact

Submission Link:

Important Dates

Industry paper (1-page extended abstract) deadline: Aug 17, 2020, 23:59 Malaysia time (GMT+8.00)
Full paper submission deadline (PDF paper): July 14, 2020, July 28, 2020, 23:59 Malaysia time (GMT +8.00)
Notification of acceptance: Sept 10, 2020
Camera-ready manuscript: Oct 1, 2020