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Thick Film Workshop by IEEE EDS Malaysia Chapter & ITMA UPM

Thick Film Workshop by IEEE EDS Malaysia Chapter & ITMA UPM
Event Dates
Starts Ends
16 Oct 2017 at 09:00 am 17 Oct 2017 at 05:00 pm
Venue Details
Bangi, Selangor
Bangi, SGR, MY

IEEE Electron Devices Society (EDS) Malaysia Chapter together with Institute of Advanced Technology (ITMA) UPM   are pleased to inform you that the Thick Film Fabrication Workshop will be organized as follows:

Date:  16 – 17th October 2017 (2 days)

Venue:  Institute of Advanced Technology (ITMA) UPM Serdang, Selangor &
Khai Lien Silk Screen, Bandar Baru Bangi.

Thick Film Technology is widely used in electronics industry, with applications in productions of resistors, sensors and IC hybrids. This technology uses ‘screen printing’ techniques that are easier to use than other techniques used in thin film technology. Realizing the significance and the role of this field in near future, this workshop is organized with aim to focus on the introduction to the technology mentioned, as well as to attract local researchers from various backgrounds to apply this technology in their research. This workshop will also introduce participants to our industry collaborator, Khai Lien Silk Screen Suppliers (M) Sdn. Bhd., which specializes in silk screen printing and stencil manufacturing.

The objectives of the workshop are:

Ø  To introduce the basic of thick film technology and screen printing method
Ø  To provide intensive hands-on sessions on the preparation of thick film materials and fabrication process
Ø  To provide platform for participants to share and explore the potential applications of thick film technology in various research fields.

At the end of the workshop, all participants will receive a starter kit which comprises of stencil frame with specified design and a squeegee, to enable participants to be able to apply thick film fabrication after the workshop.

Tentative Program: 

DAY 1: 16 October 2017

09.00 – 09.30am: Registration
09.30 – 09.45am: Welcoming remarks
09.45 – 10.45am: Talk 1 – Introduction to Thick Film Technology
10.45 – 11.15am: Morning Break
11.15 – 12.15pm: Talk 2 – Thick Film Paste Preparation
12.15 – 12.30pm: Photo Session
12.30 – 02.00pm: Lunch
02.00 – 04.30pm: ‘Hands-on’ Session 1 – Thick film paste preparation
04.30 – 05.00pm: Tea break & End of Day 1

DAY 2: 17 October 2017

09.00 – 10.00am: Talk 3 – Introduction to Screen Printing
10.00 – 10.30am: Morning Break
10.30 – 12.30pm: ‘Hands-on’ Session 2 – Screen printing process
12.30 – 02.00pm: Lunch
02.00 – 04.30pm: ‘Hands-on’ Session 3 – Thick film final fabrication
04.30 – 05.00pm: Tea break & End of Day 2

Registration Fee

IEEE Student Member: RM500.00

Non-IEEE Student Member: RM550.00

IEEE Member: RM600.00

Non-IEEE Member: RM650.00

Payment method: Cash, bank draft or online transfer payable to:

Name: Electron Devices Society

Bank: CIMB Bank

Acc. No: 12150011217052 (old) or 8002166442 (new)

Registration deadline30th Sept 2017

Register at

Registration is limited to 30 participants. Confirmation will be based of PAID registrations.

Please refer to attached brochure for more detailed information.

For more information about the event, please contact:
Puan Intan Helina at

Don’t miss your chance! See you there.

Thank You

Dr. Haslina Jaafar

IEEE Electron Devices Malaysia Chapter 2017

Department of Electrical & Electronics,

Faculty of Engineering

Universiti Putra Malaysia

43400 Serdang, Selangor



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