|5 Nov 2017 at 09:00 am||8 Nov 2017 at 05:00 pm|
IEEE TENCON 2017 – BRIDGING THE GAP
5 – 8 NOVEMBER 2017
PENANG ISLAND, MALAYSIA
CALL FOR PAPERS
It is with great pleasure for IEEE Malaysia Section to announce the 2017 IEEE Region 10 Conference (TENCON) in Penang Island, Malaysia from 5 8 November 2017.
TENCON is a premier international technical conference of IEEE Region 10, which comprises 57 Sections, 6 Councils, 21 Subsections, 514 Chapters and 1159 Student Branches in the Asia Pacific region.
The theme for TENCON 2017 is Bridging the Gap and it focuses on emerging technologies not only to bridging the gap between theory and practice but also bridging the gap between technology and public. The scope of the conference includes but not limited to the following areas:
Antenna & Microwave
Biomedical Engineering Circuit & Systems
Computational Intelligence, Cloud Computing and Big Data Analytics
Computer Architecture & Systems
Devices, Materials & Processing
Disasters and Humanitarian Technology
Marine and Offshore Engineering
Power & Energy
Robotics, Control System & Theory
Signal and Image Processing
Software & Database
Systems System, Man and Cybernetics
Social Implications of Technology
Wireless Communication & Networks
TENCON 2017 will feature both invited and contributed papers. The best papers will be selected from the contributed papers for awards. The presented papers will be submitted to IEEE Xplore which is indexed by major databases.
Prospective authors are invited to submit full papers up to six pages with double column IEEE Conference to http://edas.info/N23209. The authors must not indicate their names and affiliations in the body of the paper submitted.
Full Paper Submission: 1st June 2017
Notification of Paper Acceptance : 15th August 2017
Early Bird Registration Deadline: 15th September 2017
Camera Ready Submission: 30th September 2017
Details of paper submission are available at http://ieeemy.org/tencon/