|12 Sep 2017 at 09:00 am||14 Sep 2017 at 05:00 pm|
The IEEE International Conference on Signal and Image Processing Applications (ICSIPA), organized biennially by the IEEE Signal Processing Society Malaysia Chapter (twice recipient of SPS Chapter of the Year Award), provides a forum for local and international researchers and engineers from academia and industry to present and discuss the latest technological advances and research results in the fields of theoretical, experimental and applied signal, image and video processing.
IEEE ICSIPA 2017 (http://spsocmalaysia.org/
icsipa2017) is the fifth in the series and will be held on 12-14 September 2017 in Kuching, Sarawak, Malaysia. Previous IEEE ICSIPA conferences, held biennially since 2009 have been major successes with 50% – 70% international participation. Papers presented in all previous IEEE ICSIPA conferences are indexed in IEEE Xplore and are listed in SCOPUS and ISI Web of Science.
IEEE ICSIPA 2017 is seeking original high quality submissions addressing innovative research in the broad field of signal, image and video processing. Papers are solicited on, but not limited to the following fields:
– Acquisition, Storage, Retrieval and Display
– Computer Vision Processing and Analysis
– Information Forensics and Security
– Biomedical Signal Processing
– Applied Signal and Speech Processing
– Emerging Technologies
Papers will be accepted only by electronic submission through the EDAS system (submission link https://edas.info/newPaper.
php?c=22909). Prospective authors are invited to submit full papers of no more than six (6) pages in standard IEEE double-column format (refer to the website for templates). Please adhere to the following deadlines to ensure that the processing, reviewing, notifications, etc. could be done in a timely manner:
Special Session Proposal: 7 March 2017
Full-paper submission: 15 March 2017
Notification of paper acceptance: 15 May 2017
Registration, Payment & Camera-ready: 15 July 2017
Thank you and Best Regards,
Vijanth S. Asirvadam,
IEEE ICSIPA, 2017